Ryzen 6000 Mobile’s Legacy: Power Control and Pluton Relative to the Ryzen 3000/5000 IOD then, there is almost nothing here that AMD hasn’t touched in some function even the USB controllers and infinity fabric have been altered for this generation of processors. So PCIe 5.0 root complexes, DDR5 memory support, updated display I/O, and more are implemented here. In terms of functionality, the IOD first and foremost is responsible for the CPU-side implementation of all the new features of the AM5 platform. As well, the more efficient process node brings down the power requirements of the IOD, especially in near-idle situations, though AMD is relying on a lot more than process nodes here. The much smaller process node allows for significantly more transistors – 3.4B on a 122m2 die, 63% more than before – which AMD can invest in new features such as integrated graphics. The jump to TSMC 6nm brings several advantages to AMD’s central chiplet. And with AMD also doing very well as a company in the last few years, they do not need to produce IODs at GloFo to meet their purchase requirements with the fab.
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With AMD no longer tightly bound to GloFo with wafer share agreement exclusivity requirements, AMD is now free to produce chips like the IOD where they see fit. The new IOD is made on TSMC’s 6nm process, a generation behind the 5nm node used for the CPU chiplets themselves, but a generation (and then-some) ahead of GlobalFoundries’ smallest node.
Previously produced on GlobalFoundries’ 14nm/12nm process node, for Ryzen 7000 the IOD has made the leap to TSMC.
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By producing a 2 or 3 chiplet-based solution rather than a single monolithic die, AMD is able to put silicon that doesn’t require cutting-edge performance on a cheaper process node, while enjoying the yield advantages that come from smaller chiplets and older, more mature nodes.Īnd yet with that said, for the Ryzen 7000 series it’s AMD’s IOD that’s getting the biggest upgrade. Whether it’s a 7600X or 7950X – one CPU chiplet or two – every Ryzen 7000 processor gets one of AMD’s new IODs.Īs with the Ryzen 3000/5000 series, the IOD is a die separate from the CPU core chiplets that hosts everything that isn’t the CPU cores or their associated L1/L2/元 caches. We’ll start our look at the Ryzen 7000 silicon with the glue that holds the chip together: the I/O Die (IOD). Ryzen 7000 I/O Die: TSMC & Integrated Graphics at Last
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